Imec shows advanced lithography to reduce CO2 emissions in chip factories

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Imec has unveiled a new climate-friendly way to produce patterns on chips using lithography and etch for advanced chip factories.

Leuven, Belgium-based Imec has introduced technology that can reduce the carbon dioxide footprint of lithography and etch processes in advanced chip factories.

Imec’s research indicates that lithography and etch processes contribute over 40% of direct emissions in advanced logic node Scope 1 and Scope 2 categories. Semiconductor devices produced in 2021 generated a CO2 equivalent footprint of about 175 megatonnes, equivalent to the yearly emissions associated with about 30 million people.

Imec’s alternatives focus on simplifying dry etch processes used in chip manufacturing to reduce environmental impact while maintaining high-quality semiconductor fabrication.

Imec.netzero Virtual Fab Model

Imec.netzero, a virtual fab model developed within Imec’s Sustainable Semiconductor Technologies and Systems (SSTS) program, played a crucial role in demonstrating emissions impact.

Imec proposes strategies for future patterning, including ultra-thin resists and underlayers, minimal passivation, and low process temperatures for etch. A High-NA-compatible metal line etch process was demonstrated, showcasing a significant reduction of approximately 94% in process gas emissions.

Addressing Lithography Challenges

Challenges in lithography include emissions from electricity generation, and engineers are exploring greener energy, reducing multi-patterning steps, minimizing photoresist dose, and enhancing scanner throughput for energy efficiency.

Imec’s initiatives in process innovation and sustainability align with the industry’s shift towards eco-friendly semiconductor fabrication.