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Semron has raised $7.9 million (7.3 million euros) for AI chips with 3D packaging for mobile devices.
Dresden, Germany-based Semron aims to establish a new standard for AI chips in mobile devices.
Leading the funding round are Join Capital, with support from SquareOne, OTB Ventures, and Onsight Ventures.
Semron, focusing on the development of advanced computer chips for small consumer devices like smartphones, earbuds, and VR headsets, promises a remarkable up to 20-fold increase in chip efficiency.
Semron’s proprietary technology, CapRAM, utilizes a novel semiconductor device architecture based on a variable capacitor (‘memcapacitor’), which results in a 20-fold increase in energy efficiency at the chip level.
Strategic seed funding round
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